1.3 Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Architecture: | SAM9 | = ARM926EJ-S Arm Thumb microprocessor |
Series: | X60 | = General purpose microprocessor |
Carrier Type: | Blank | = Standard packaging (tray) |
T | = Tape and reel | |
Temperature Range: | V | = -40°C to +105°C (Extended Industrial temperature) |
Package: | DWB | = TFBGA228 |
6GW | = TFBGA256 | |
Software License Level: | Blank | = Standard |
SL1 | = Level 1 | |
SL2 | = Level 2 | |
SL3 | = Level 3 | |
Pattern: | Blank | = Standard device |
VAO | = Automotive flow/material without PPAP. Available upon request. | |
Vxx | = Automotive flow/material with associated PPAP. Available upon request. |
Example:
- SAM9X60T-V/DWB-SL3VAO = ARM926EJ-S Arm Thumb microprocessor for Automotive applications, Tape and reel, Extended Industrial temperature, 228-ball TFBGA package, software license level 3, automotive flow/material without PPAP
Note: The Tape and Reel identifier and the Software License Level identifier only appear in the
catalog part number description. These identifiers are used for ordering purposes and are
not printed on the device package. Check with your Microchip Sales Office for package
availability.