Pin Configuration and Pinouts
| Package = 8-Lead SOIC or 8-Pad VDFN | Package = 3-Lead Contact | ||||||
|---|---|---|---|---|---|---|---|
| Pin # | Function | I2C | SWI | Pin # | Function | SWI | |
| 1-3,7 | No Connect | NC | NC | 1 | Serial I/O | SI/O | |
| 4 | Ground | GND | GND | 2 | Ground | GND | |
| 5 | Serial I/O | SDA | SI/O | 3 | Supply | VCC | |
| 6 | Serial Clock | SCL | NC | — | — | — | |
| 8 | Supply | VCC | VCC | — | — | — | |
Note:
- Exposed backside paddle of the VDFN package is recommended to be connected to GND.
: The UDFN
Package has been deprecated for use with the TA010
in favor of the VDFN package with wettable flanks.
The board land pattern is identical for both
packages. The UDFN package will continue to be
supported for existing customers on existing
programs.