8 Revision History
Revision C (October 2025)
: No changes have been made to the functional
operation or electrical characteristics of the device.
- Features
- Updated random number generator bullet to indicate a True Random Number Generator (TRNG)
- Added bullet to indicate AEC-Q100 automotive qualified
- Corrected SWI-PWM speed to 100 kbps
- Random Number Generator (RNG)
- Updated to indicate that the RNG is a TRNG
- Added certification information associated with the RNG
- Updated SP 800-90C to the released version of the spec
- Package Drawings
- Updated VDFN package outline drawings to latest version
- Updated SOIC package outline drawings to latest version
Revision B (February 2025)
: No changes were made to the actual silicon.
Changes are only to the data sheet.
- Features: Corrected the package size of the UDFN package and added VDFN
- DC Parameters: All I/O Interfaces
- Added input thresholds when in Sleep mode (VILS, VIHS)
- Added θJA for the VDFN package type and updated the SOIC θJA and 3-Lead Contact values
- Package Drawings: Added VDFN package information
- Product Identification System: Product identification is now a separate section and not part of Back Matter. Added VDFN package information.
- Microchip Information: Back Matter simplified per Microchip’s new standard
Revision A (March 2023)
Original release of the document
