8 Revision History
Revision C (October 2025)
: No changes have been made to the functional
                operation or electrical characteristics of the device.
            - Features
- Updated random number generator bullet to indicate a True Random Number Generator (TRNG)
 - Added bullet to indicate AEC-Q100 automotive qualified
 - Corrected SWI-PWM speed to 100 kbps
 
 - Random Number Generator (RNG)
- Updated to indicate that the RNG is a TRNG
 - Added certification information associated with the RNG
 - Updated SP 800-90C to the released version of the spec
 
 - Package Drawings
- Updated VDFN package outline drawings to latest version
 - Updated SOIC package outline drawings to latest version
 
 
Revision B (February 2025)
: No changes were made to the actual silicon.
                Changes are only to the data sheet.
            - Features: Corrected the package size of the UDFN package and added VDFN
 - DC Parameters: All I/O Interfaces
- Added input thresholds when in Sleep mode (VILS, VIHS)
 - Added θJA for the VDFN package type and updated the SOIC θJA and 3-Lead Contact values
 
 - Package Drawings: Added VDFN package information
 - Product Identification System: Product identification is now a separate section and not part of Back Matter. Added VDFN package information.
 - Microchip Information: Back Matter simplified per Microchip’s new standard
 
Revision A (March 2023)
Original release of the document
