4.7 WBZ45 Module Reflow Profile Information

The WBZ45 module was assembled using the IPC/JEDEC J-STD-020 Standard lead free reflow profile. The WBZ45 module can be soldered to the host board using standard leaded or lead-free solder reflow profiles. To avoid damaging the module, adhere to the following recommendations:

• For Solder Reflow Recommendations, refer to the Solder Reflow Recommendation Application Note (AN233).
• Do not exceed a peak temperature (TP) of 250°C.
• Refer to the solder paste data sheet for specific reflow profile recommendations from the vendor.
• Use no-clean flux solder paste.
• Do not wash as moisture can be trapped under the shield.
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.