5.7 Oscillators and CLK_OUT

All parameters refer to GND (backplane) and are valid for Tamb = -40°C to +85°C, VVS = 1.9-3.6V (3V application) and 2.4-5.5V (5V application) over all process tolerances, quartz parameters Cm = 4 fF and C0 = 1 pF, unless otherwise specified. Typical values are given at VVS = 5V, Tamb = 25°C and for a typical process, unless otherwise specified. Crystal oscillator frequency fXTO = 24.305 MHz. Standard Microchip EEPROM settings are used unless marked with *1.
Table 5-4. Oscillators and CLK_OUT
No.ParametersTest ConditionsPinSymbolMin.Typ.Max.UnitType*
13.00CLK_OUT equivalent internal capacitanceUsed for current calculation13,22CCLK7.510pFC
13.10Supply current increase CLK_OUT activeApply calculation to all operation modes except OFFMode13ΔICLK (CCLK+CLOAD_CLK_OUT) x VVS x fOUTAC
13.30XTO frequency range10, 11fxto23.824.30526.2MHzC
13.40XTO pulling due to internal capacitance and XTO toleranceCm = 4 fF

Tamb = 25°C

10, 11ΔFXTO1-10+10ppmB
13.50XTO pulling due to temperature and supply voltageCm = 4 fF

Tamb = -40°C to +85°C

10, 11ΔFXTO2-4+4ppmB
13.60Maximum C0 of XTALXTAL parameter10, 11C0_max12pFD
13.70XTAL, Cm motional capacitanceXTAL parameter10, 11Cm410fFD
13.90XTAL,real part of XTO impedance at start-upCm = 4 fF

C0 = 1 pF

Tamb<85°C

10, 11Re_start21100B
14.00XTAL,maximum Rm after start-upXTAL parameter10, 11Rm_max110D
14.10Internal load capacitorsIncluding ESD and package capacitance. Specify XTAL for 7.5 pF load capacitance (including 1 pF PCB capacitance per pin)10, 11CL1, CL213.31414.7pFB
14.20Slow RC oscillator frequencyPolling cycle can be calibrated ±2% accurate with fXTO22fSRC-10%125+10%kHzA
14.30Fast RC oscillator frequencyFRC oscillator can be calibrated ±2% accurate with fXTO22fFRC-5%6.36+5%MHzA
Note: *1 Type means: A = 100% tested at voltage and temperature limits, B = 100% correlation tested, C = Characterized on samples and D = Design parameter.