10.1 SAM9X60D1G-I/LZB Dimensions

Figure 10-1. SAM9X60D1G-I/LZB Dimensions
Table 10-1. SAM9X60D1G-I/LZB Dimensions (in mm)
Parameter Symbol Common Dimensions Comments
Min Typ Max
Body overall dimensions X E 27.900 28.000 28.100
Y D 27.900 28.000 28.100
Pad pitch e – 0.650 –
PCB thickness S 1.150 1.200 1.250
SOM total thickness A1 – 2.400 2.450
Pad length1 Top side P1t – 0.550 –
Bottom side P1b – 0.800 –
Pad width1 P2 – 0.450 –
Pad gap1 aaa – 0.200 –
Opening drill diameter fff – 0.300 – 0.300 typical minus metallization
Pad count n – 152 –
Test point diameter jjj – 1.000 –
Test point count m – 3 –
Pad edge to SOM edge1 X P2Ea – 1.750 –
Y P2Eb – 1.750 –
SOM edge to first component edge E2Ca – 1.150 –
E2Cb – 1.425 –
E2Cc – 1.225 –
E2Cd – 1.225 –
Note:
  1. Tolerances are defined as per standards:
    • IPC A600 – Class2
    • IPC 2615
  2. Test points placed under the SAM9X60D1G-I/LZB are for production purposes only. No connection to these points is allowed. To avoid any contact with the main board vias or copper areas, see the following table.
Table 10-2. Test Point Position Compared to Origin
Test Point Number X (in mm) Y (in mm)
TP1 14.400 24.925
TP2 14.500 9.200
TP3 20.550 2.475