52.3.3 64-Pin VQFN

Note: The exposed die attach pad is not connected electrically inside the device. It is recommenced to attach (solder) the exposed pad to a matching perimeter landing beneath the package punctuated with vias to the ground layer.

Table 52-6. Device and Package Maximum Weight
200	mg

Table 52-7. Package Reference
Package Outline Drawing MCHP reference	C04-21441
JESD97 Classification	E3