52.3.9 48-Pin VQFN

Note: The exposed die attach pad is not connected electrically inside the device. It is recommenced to attach (solder) the exposed pad to a matching perimeter landing beneath the package punctuated with vias to the ground layer.

Table 52-18. Device and Package Maximum Weight
140	mg

Table 52-19. Package Reference
Package Outline Drawing MCHP reference	C04-21425
JESD97 Classification	E3