52.3 Package Drawings

Note: For current package drawings, refer to the Microchip Packaging Specification, which is available at http://www.microchip.com/packaging.

Note: For QFN packages with an exposed die attach pad: The exposed die attach pad is not connected electrically inside the device. It is recommenced to attach (solder) the exposed pad to a matching perimeter landing beneath the package punctuated with vias to the ground layer.

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