10.1 Package Marking Information
8U-6, 8-ball (3x5 Array) Wafer Level Chip Scale Package (WLCSP)
Note: For the most current package drawings, please see the Microchip Packaging
Specification located at http://www.microchip.com/packaging.
8U-6, 8-ball (3x5 Array) Wafer Level Chip Scale Package (WLCSP)
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.