11 Revision History
Revision B (October 2024)
Updated date code format on Package Marking Information page; Updated title; Removed typical column in DC Characteristics table; Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively; Minor editorial updates throughout the document.
Revision A (March 2019)
Updated to Microchip template. Microchip DS20006170 replaces Atmel document 8812. Corrected tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns. Updated Part Marking Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Added a figure for “System Configuration Using Two-Wire Serial EEPROMs”. Added POR recommendations section. Updated SOIC, SOIJ and TSSOP package drawings to Microchip format.
Atmel Document 8812 Revision F (January 2015)
Updated the ordering information section, part markings, and the 8X and 8S2 package outline drawings.
Atmel Document 8812 Revision E (March 2013)
Updated document status from preliminary to complete. Corrected WLCSP pinout. Updated footers and disclaimer page.
Atmel Document 8812 Revision D (January 2013)
Corrected TSSOP pin label 7 to WP.
Atmel Document 8812 Revision C (December 2012)
Added WLCSP package. Updated part markings. Updated pinout diagram. Updated part markings. Corrected Byte Write figure from second typo error to first word address. Updated Sequential Read figure.
Atmel Document 8812 Revision B (July 2012)
Corrected ordering code: AT24CM01-WWU-11, Die Sale to AT24CM01-WWU11M, Wafer Sale. Updated Atmel logos and disclaimer page.
Atmel Document 8812 Revision A (May 2012)
Initial release of this document.