50.9 Thermal Characteristics

Table 50-6. Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Param No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance Junction to Ambient 48.3 °C/W 28-pin SPDIP package
45.2 °C/W 28-pin SOIC package
53.7 °C/W 28-pin SSOP package
36.3 °C/W 28-pin VQFN package
40.0 °C/W 40-pin PDIP package
29.9 °C/W 40-pin QFN package
57.5 °C/W 44-pin TQFP package
50.7 °C/W 48-pin TQFP package
25.9 °C/W 48-pin VQFN package
TH02 TJMAX Maximum Junction Temperature 150 °C
Note:
  1. See Absolute Maximum Ratings for total power dissipation.