50.9 Thermal Characteristics
Standard Operating Conditions (unless otherwise stated) | |||||
---|---|---|---|---|---|
Param No. | Sym. | Characteristic | Typ. | Units | Conditions |
TH01 | θJA | Thermal Resistance Junction to Ambient | 48.3 | °C/W | 28-pin SPDIP package |
45.2 | °C/W | 28-pin SOIC package | |||
53.7 | °C/W | 28-pin SSOP package | |||
36.3 | °C/W | 28-pin VQFN package | |||
40.0 | °C/W | 40-pin PDIP package | |||
29.9 | °C/W | 40-pin QFN package | |||
57.5 | °C/W | 44-pin TQFP package | |||
50.7 | °C/W | 48-pin TQFP package | |||
25.9 | °C/W | 48-pin VQFN package | |||
TH02 | TJMAX | Maximum Junction Temperature | 150 | °C | |
Note:
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