Embedded Trace module with instruction trace stream,
including 16 Kbytes of CoreSight™ Embedded Trace buffer
32 Kbytes of L1 data cache, 32 Kbytes of L1 instruction
cache
256 Kbytes of L2 cache
Up to 1-GHz operational frequency
Voltage and frequency scaling support
64-bit generic timers
Internal Memory Architecture
128 Kbytes of internal SRAM and 5 Kbytes of secure backup
RAM
80 Kbytes of maskable ROM, embedding a secure bootloader
(boot on QSPI NOR, SLC NAND, SD, e.MMC)
96-Kbyte ROM for NAND Flash ECC tables
40-Kbyte ROM for crypto-libraries (RSA, ECC, etc.)
11-Kbyte internal OTP
External Memory Support
16-bit high-bandwidth, double data rate multi-port dynamic
RAM controller. Supports up to 16-Gbit 8-bank DDR2/DDR3/DDR3L/LPDDR2/LPDDR3
up to 533 MHz
16-bit static memory controller, FPGA support with
synchronous clock
8-bit SLC and MLC NAND controller with up to 32-bit error
correcting code
One 8-bit high-speed memory card host e.MMC 5.1 (HS400),
SD3.0 SDR104 mode support
Two 4-bit high-speed memory card hosts e.MMC 4.51 (HS200),
SD3.01 SDR104 mode support
One octal Serial Peripheral Interface running up to 200-MHz
DDR
One quad Serial Peripheral Interface
System
Power-on reset cells, reset controller, shutdown
controller, watchdog and secure watchdog timers running on internal slow RC
oscillator (32 kHz typical) and real-time clock running on slow crystal
oscillator (32.768 kHz)
Two internal trimmed RC oscillators with typical values: 32
kHz and 12 MHz
Two crystal oscillators: 32.768 kHz and 20 to 50 MHz
Eight PLLs for core, system bus and peripherals, serial
interfaces, DDR I/Os, pixel clock, audio, USB, MIPI CSI-2 and Ethernet
Two 32-channel DMA with per-channel security
configuration
One 8-channel DMA dedicated to memory-to-memory
transactions
Eight programmable clock output signals
Power Considerations
Different power domains and power modes to reduce power
consumption
Low-power consumption in Backup mode with 5 Kbytes of
secure backup SRAM and DDR-SDRAM in Self-Refresh mode
Low-power with SRAM and register retention, wake-up from
various events (USB, CAN, Ethernet WOL, FLEXCOMs), internal events (RTC,
timer) and I/O activity
Embedded LDOs for MIPI CSI-2, analog and PLLs, to enable
low-cost power management solutions
Optimum connection to
Microchip MCP16501/2 PMICs to enter and exit various power modes of the
application
Multimedia Peripherals
Audio
Two synchronous serial controllers, each with 16
channels of up to 32-bit TDM data
One inter-IC sound multi-channel controller with
TDM256 support
Up to two 4-channel pulse density microphone
controllers; support for eight microphones in parallel
One Sony/Philips digital interface transmitter and
receiver
Audio sample rate converter including four stereo
channels
Image
Image sensor controller, ITU-R BT. 601/656
supporting up to eight megapixels for still images and 60 fps in
720p mode, 8 bits, raw Bayer, YCbCr, monochrome, camera ISP
2-lane MIPI CSI-2 (D-PHY) and 12-bit RGB interface
support
Peripherals
Two high-speed USB devices and three high-speed USB hosts
sharing three on-chip transceivers
One 10/100/1000 Gigabit Ethernet MAC supporting RGMII, MII
and RMII (GMAC0) and one 10/100 Ethernet MAC supporting MII and RMII (GMAC1)
compliant with:
IEEE802.3az Energy-Efficient Ethernet
IEEE802.1AS Timestamping for Ethernet AVB
support
IEEE802.1Qav Credit-based traffic shaping hardware
support
IEEE1588 Precision Time Protocol
IEEE1588 Timestamp Unit (TSU) with TSU timer
comparison signal triggering a timer counter and available on a PIO
line
Six flexible data rate CAN-FD controllers with SRAM-based
mailboxes with time- and event-triggered transmission
Twelve FLEXCOMs (USART, SPI and TWIHS)
Six 64-bit timers
Two three-channel 32-bit timer counters, with PWM
generation
One four-channel 16-bit PWM controller
One 19-channel 12-bit analog-to-digital converter, up to 1
Msps
Safety
Temperature and core voltage monitoring
Zero-power power-on reset cells
Main crystal monitor and clock failure detector with
failsafe switchover to main RC oscillator
32 kHz crystal monitor and clock failure detector with
failsafe switchover to internal 32 kHz RC oscillator
One Secure TrustZone watchdog timer running on RC
oscillator, providing protection against TrustZone starvation
Temperature, voltage and frequency monitoring
Secure backup SRAM
5 Kbytes scrambled with non-imprinting support
powered with VBAT or VDDIN33:
1 Kbyte non
erasable on tamper detection
4 Kbytes
erasable on tamper detection
Four tamper pins for static or dynamic detection
Can be used as regular wake-up lines
256-bit general purpose backup register, erasable on tamper
detection
Programmable OTP with bits available for user purposes
Configurable JTAG security (full debug, non-secure-only
debug, no debug)
128-bit AES on-the-fly encryption/decryption on DDR memory,
SMC, QSPI0 and QSPI1, including automatic key load at start-up. Separate
keys for secure and non-secure accesses (TZAESB).
True random number generator compliant with NIST Special
Publication 800-22 Tests Suite and FIPS PUB 140-2 and 140-3
Secure RTC
Cryptography
SHA (SHA1, SHA224, SHA256, SHA384, SHA512) compliant with
FIPS Publications 180-2
AES: 256-, 192-, 128-bit key algorithm, compliant with FIPS
PUB 197 specifications
TDES: two-key or three-key algorithms, compliant with FIPS
PUB 46-3 specifications
Public Key Coprocessor (CPKCC) and associated Classical
Public Key Cryptography Library (CPKCL) for RSA, DSA, ECC GF(2n),
ECC GF(p)
Up to 136 I/Os
Fully programmable through set/clear registers
Multiplexing of eight peripheral functions per I/O
line
Each I/O line can be assigned to a peripheral or used as a
general purpose I/O
Synchronous output, possibility to set or clear
simultaneously up to 32 I/O lines in a single write
General purpose analog and digital inputs tolerant to positive and negative
current injection
Design for Low ElectroMagnetic
Interference (EMI)
Slewrate-controlled I/Os
DDR PHY with
impedance-calibrated drivers
Spread spectrum PLLs
Careful BGA power/ground ball
assignment to provide optimum decoupling capacitors placement
Microchip Recommended Power Management Integrated Circuits (PMICs)
MCP16502, 6-channel PMIC with
I²C control interface; supports dynamic voltage scaling and processor
Low-Power modes (ULP2, BSR)
AEC-Q100 Grade 2 qualified
using the following mission profile:
20 khrs of operation
with junction temperature usage as -40°C = 6% of lifetime, 70°C
= 25%, 85°C = 25%, 100°C = 25%, 115°C = 14%, 125°C = 5%
Maximum CPU speed =
800 MHz
ESD-CDM classification level C2
AEC-Q006 set of tests applies as only copper wire interconnections are
used
Package
14x14 mm², 0.65 mm pitch,
343-ball TFBGA, optimized for standard class PCB layout (down to four
layers)
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