10 Revision History

Revision B (June 2021)

Replaced “Master” and “Slave” terminology with “Host” and “Client”, respectively. Removed UDFN package option. Updated SOIC and TSSOP package drawings.

Revision A (June 2019)

Updated to the Microchip template. Microchip DS20006218 replaces Atmel document 5165. Updated Part Marking Information. Added ESD rating. Removed lead finish designation. Added POR recommendations section. Changed Data Retention spec to 100 year. Updated trace code format in package markings. Updated section content throughout for clarification. Updated the SOIC, TSSOP and UDFN package drawings to the Microchip equivalents.

Atmel Document 5165 Revision K (January 2017)

Removed waffle pack die sale option. Changed wafer sales note.

Atmel Document 5165 Revision J (January 2015)

Updated the 8X package outline drawing and the ordering information section.

Atmel Document 5165 Revision I (July 2013)

Correct ordering code table from 8A2 to 8X package option. Updated footers and disclaimer page.

Atmel Document 5165 Revision H (August 2012)

Updated part markings and package drawings. Updated template.

Atmel Document 5165 Revision G (September 2009)

Updated Part Marking Scheme.

Atmel Document 5165 Revision F (March 2009)

Changed Maximum Operating Voltage from 4.3V to 6.25V in the Absolute Maximum Table on page 2.

Atmel Document 5165 Revision E (August 2008)

Updated for 1.8V - 5.5V operation.

Atmel Document 5165 Revision D (May 2008)

Added part marking diagram information.

Atmel Document 5165 Revision C (August 2007)

Changed address bit number to seven on page 9. Removed Preliminary status.

Atmel Document 5165 Revision B (March 2007)

Changed spacing on table notes. Reworked Figure 4-8. Updated to new template. Change status to Preliminary.

Atmel Document 5165 Revision A (January 2007)

Initial document release.