4 Recommended Reflow Profiles

Figure 4-1. Recommended Reflow Profiles for Pb-Free and Sn-Pb
Table 4-1. 230°C Reflow ProfileAll temperatures refer to top side of the package, measured on the package body surface.
Profile FeatureSn-Pb AssemblyProfile FeatureSn-Pb Assembly
Average ramp-up rate (tL to tP)3°C/second max.Time 25°C to Peak Temperature4 minutes max.

Preheat

Temperature min. TS(MIN)

Temperature min. TS(MAX)

Time (min. to max.) (tS)

135°C

155°C

60-90 seconds

Time maintained above

Temperature (TL)

Time (tL)

183°C

45-60 seconds

TS(MAX) to TL ramp-up rate3°C/second max.——

Time maintained above Temperature (TL)

Time (tL)

183°C

40-60 seconds

Time within 5°C of actual Peak Temperature (tP)

10-20 seconds max.

Peak Temperature (TP)230°C max.Ramp-down Rate6°C/second max.
Table 4-2. 260°C Reflow ProfileAll temperatures refer to top side of the package, measured on the package body surface.
Profile FeaturePb-Free AssemblyProfile FeaturePb-Free Assembly
Average ramp-up rate (tL to tP)3°C/second max.Time 25°C to Peak Temperature8 minutes max.

Preheat

Temperature min. TS(MIN)

Temperature min. TS(MAX)

Time (min. to max.) (tS)

150°C

200°C

60-180 seconds

Time maintained above

Temperature (TL)

Time (tL)

217°C

60-150 seconds

TS(MAX) to TL ramp-up rate3°C/second max.——

Time maintained above

Temperature (TL) Time (tL)

217°C

60-150 seconds

Time within 5°C of actual Peak

Temperature (TP)

20-40 seconds max.

Peak Temperature (TP)260°C max.Ramp-down Rate6°C/second max.