1 Performance Specifications

Table 1-1. Frequency Stabilities
Parameter	Min.	Typ.	Max.	Units	Condition
Overall Tolerance (Includes Operation Temperature and Initial Accuracy)	−25	—	25	ppm	See Table I under Product Identification System Referenced to nominal frequency @ +25°C
	−50		50
	–65		65
	−100		100
vs. supply Voltage Change	−2	—	2	ppm	V_S ±5%
vs. Load Change	−1	—	1	ppm	Load ±5%
vs. Aging/Year (Year 1)	−3	—	3	ppm	After 30 days of operation

Table 1-2. Supply Voltage (V_S)
Parameter	Min.	Typ.	Max.	Units	Condition
Supply Voltage	3.135	3.3	3.465	VDC	—
	2.375	2.5	2.625	VDC	—
	1.710	1.8	1.890	VDC	—

Table 1-3. Supply Current
Parameter	Min.	Typ.	Max.	Units	Output	Frequency Range
Current Consumption No Load V_S = 3.465 VDC	—	—	3	mA	CMOS	1.25MHz to < 12MHz
			5	mA		12MHz to < 48MHz
			10	mA		48MHz to < 85MHz
			15	mA		85MHz to 135MHz
			40	mA	LVDS	100MHz to 250MHz
Current Consumption No Load V_S = 2.625 VDC	—	—	2	mA	CMOS	1.25MHz to < 12MHz
			4	mA		12MHz to < 48MHz
			9	mA		48MHz to < 85MHz
			12	mA		85MHz to 135MHz
			35	mA	LVDS	100MHz to 250MHz
Current Consumption No Load V_S = 1.89 VDC	—	—	1.5	mA	CMOS	1.25MHz to < 12MHz
			3	mA		12MHz to < 48MHz
			8	mA		48MHz to < 85MHz
			10	mA		85MHz to 135MHz
			25	mA	LVDS	10MHz to 175MHz

Table 1-4. CMOS Output
Parameter	Min.	Typ.	Max.	Units	Condition
Frequency Range	1.3	—	135	MHz	V_DD = 1.8V, 2.5V, 3.3V
Load	—	—	15	pF	—
Signal Level (V_OL)	—	—	0.3	VDC	V_S= 3.3V and 15pF load
			0.25	VDC	V_S = 2.5V and 15pF load
			0.18	VDC	V_S = 1.8V and 15pF load
Signal Level (V_OH)	3	—	—	VDC	V_S = 3.3V and 15pF load
	2.3			VDC	V_S = 2.5V and 15pF load
	1.6			VDC	V_S = 1.8V and 15pF load
Rise/Fall Times (10% to 90%)	—	—	10	ns	1.0MHz to 23.9MHz
			6	ns	24.0MHz to 79.9MHz
			3	ns	80.0MHz to 135.0MHz
Duty Cycle	45	50	55	%	Measured at 50% of V_DD

Table 1-5. LVDS Output
Parameter	Min	Typ	Max	Units	Condition
Frequency Range	100	—	250	MHz	V_DD = 2.5V or 3.3V
Frequency Range	100	—	175	MHz	V_DD = 1.8V
Signal Level (V_OL)	—	1.2	—	VDC	R_L = 100Ω
Signal Level (V_OH)	—	1.4	—	VDC	R_L = 100Ω
Differential Voltage (V_OD)	250	—	460	mV	R_L = 100Ω
Offset Voltage (V_OS)	1.13	—	1.45	V	R_L = 100Ω
Rise/Fall Times	—	600	1000	ps	20% to 80% of V_OD
Duty Cycle	45	—	55	%	Measured at 50% of V_OD

Note: Please email VOP-Support@microchip.com for technical questions, sales, or other product support.

Figure 1-1. LX-820: 100MHz, LVDS Output, 3.3V - Typical Performance

Figure 1-1. LX-820: 100MHz, LVDS Output, 3.3V - Typical Performance

Figure 1-2. LX-820: 156.25MHz, LVDS Output, 3.3V - Typical Performance

Figure 1-2. LX-820: 156.25MHz, LVDS Output, 3.3V - Typical Performance

Figure 1-3. LX-820: 40MHz, CMOS Output, 3.3V - Typical Performance

Figure 1-3. LX-820: 40MHz, CMOS Output, 3.3V - Typical Performance

Figure 1-4. LX-820: 125MHz, CMOS Output, 3.3V - Typical Performance

Figure 1-4. LX-820: 125MHz, CMOS Output, 3.3V - Typical Performance

Table 1-6. Additional Parameters
Parameter	Conditions	Additional Notes
Screening	Microchip Verification (Standard “X”)	See the following table for Tests
Screening	Class B, MIL-PRF-55310 (Optional)	See the following table for Tests
Output Enable	Logic “0” input == Output disabled (Tri-state)	—
Output Enable	Logic “1” or floating input == Output enabled	—
Weight	< 2 grams	—
Processing and Packing	Tape and Reel	—
RoHS Compliance	RoHS 6	Unless Sn/Pb solder coated
REACH Compliance	Yes	—
Solder Coated Pads	Sn63/Pb37 Solder (Optional)	See Package Code in Part Number
Moisture Sensitivity Level (MSL)	1	Ceramic package, Seam sealed
MTBF/FIT (Generic)	480,000,000 Hours	MIL-HBK-217, Hybrid, Space Flight, Commercial Contact Factory for Custom MTBF/FIT
ECCN	EAR99	—
Software 3D Model	IGS/STEP file	Contact VOP-Support@microchip.com

Table 1-7. Standard Microchip Verification “X” in Screening Option
Test	Test Conditions
Internal Visual Inspection	MIL-STD-883, Methods 2017, 2032
Stabilization Bake	MIL-STD-883, Method 1008, Condition C, 150°C, 24 hours minimum
Temperature Cycling	MIL-STD-883, Method 1010, Condition B
High-Temperature Reflow	2 cycles of solder reflow profile, SnPb Standard, See Section 4 for profile
Seal Test (Fine Leak)	MIL-STD-883, Method 1014, Condition A2, Class B
Seal Test (Gross Leak)	MIL-STD-883, Method 1014, Condition C

Table 1-8. Optional MIL-PRF-55310 Product Level B Screening, Class 2 OscillatorSee “Screening Option” in Part Number.
Test	Test Conditions
Internal Visual Inspection	MIL-STD-883, Methods 2017, 2032
Stabilization Bake	MIL-STD-883, Method 1008, Condition C, 150ºC, 24 hours min
Temperature Cycling	MIL-STD-883, Method 1010, Condition B
High-Temperature Reflow	2 cycles of solder reflow profile, SnPb Standard, See last page for profile
Constant Acceleration	MIL-STD-883, Method 2001, Condition A, Y1 Plane only
Seal Test (Fine Leak)	MIL-STD-883, Method 1014, Condition A2, Class B
Seal Test (Gross Leak)	MIL-STD-883, Method 1014, Condition C
Burn-In	160 hours minimum at 125°C, nominal voltage, specified load
External Visual Inspection	MIL-STD-883, Method 2009

Table 1-9. Absolute Maximum Ratings
Parameter	Min.	Typ.	Max.	Units	Condition
Supply Voltage	−0.3	—	4	VDC	—
Mechanical Shock	1000			G	MIL-STD-202, 0.5ms half-sine pulse
ESD	2000			Volts	HBM per MIL-STD-883, Method 3015
Operable Temperature Range	−55	—	125	°C	Operable temperature range implies the device will continue to operate with no long-term damage to unit; however, it may not be specification-compliant outside the operating temperature range.

DS20007199A

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