9 Revision History
Revision B (June 2023)
Fixed Tpoff timing in Table 4-4. Replaced "master" and "slave" terminology with "host" and "client", respectively.
Revision A (February 2020)
Updated to Microchip template. Microchip DS20006310 replaces Atmel document 8803. Updated Part Marking Information. Added ESD rating. Removed lead finish designation. Removed the Automotive Grade 2 option. Corrected operating ranges for Table 4-3. Updated POR recommendations section. Updated trace code format in package markings. Updated formatting throughout for clarification. Updated the SOIC, TSSOP and UDFN package drawings to the Microchip equivalents.
Atmel Document 8803 Revision E (September 2016)
Added the Automotive Grade 2 and 3 options and UDFN options.
Atmel Document 8803 Revision D (June 2015)
Updated ordering codes tables and Section 7.1, part marking information, 8S1 and 8X package drawings, footers and reorganized the document.
Atmel Document 8803 Revision C (December 2012)
Condensed and updated ordering code table.
Atmel Document 8803 Revision B (August 2012)
Removed preliminary status. Updated Atmel logos and disclaimer/copy page.
Atmel Document 8803 Revision A (February 2012)
Initial document release.