44.1.11 32-Pin VQFN
Note: The exposed die attach pad is connected
inside the device to GND and GNDANA.
90 | mg |
Package Outline Drawing MCHP reference | C04-21402 |
JESD97 Classification | E3 |
90 | mg |
Package Outline Drawing MCHP reference | C04-21402 |
JESD97 Classification | E3 |