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Low-Power, 32-bit Cortex-M0+ MCU with Advanced Analog and PWM
Low-Power, 32-bit Cortex-M0+ MCU with Advanced Analog and PWM
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ATSAMD21E15 ATSAMD21E15L ATSAMD21E16 ATSAMD21E16L ATSAMD21E17 ATSAMD21E18 ATSAMD21G15 ATSAMD21G16 ATSAMD21G16L ATSAMD21G17 ATSAMD21G18 ATSAMD21J15 ATSAMD21J16 ATSAMD21J17 ATSAMD21J18
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  2. 44 Packaging Information
  3. 44.1 Package Drawings

  • Features
  • 1 Description
  • 2 Configuration Summary
  • 3 SAM D21 Ordering Information(1)
  • 4 Block Diagram
  • 5 Pinout
  • 6 Signal Descriptions List
  • 7 I/O Multiplexing and Considerations
  • 8 Power Supply and Start-Up Considerations
  • 9 Product Mapping
  • 10 Memories
  • 11 Processor And Architecture
  • 12 Peripherals Configuration Summary
  • 13 DSU - Device Service Unit
  • 14 Clock System
  • 15 GCLK - Generic Clock Controller

  • 16 PM – Power Manager
  • 17 SYSCTRL – System Controller
  • 18 WDT – Watchdog Timer
  • 19 RTC – Real-Time Counter
  • 20 DMAC – Direct Memory Access Controller
  • 21 EIC – External Interrupt Controller
  • 22 Nonvolatile Memory Controller (NVMCTRL)
  • 23 PORT - I/O Pin Controller
  • 24 EVSYS – Event System
  • 25 SERCOM – Serial Communication Interface
  • 26 SERCOM USART
  • 27 SERCOM SPI – SERCOM Serial Peripheral Interface
  • 28 SERCOM I2C – Inter-Integrated Circuit
  • 29 I2S - Inter-IC Sound Controller
  • 30 TC – Timer/Counter
  • 31 TCC – Timer/Counter for Control Applications
  • 32 USB – Universal Serial Bus
  • 33 ADC – Analog-to-Digital Converter
  • 34 AC – Analog Comparators
  • 35 DAC – Digital-to-Analog Converter
  • 36 Peripheral Touch Controller (PTC)
  • 37 Electrical Characteristics at 85℃
  • 38 Electrical Characteristics at 105°C
  • 39 Electrical Characteristics at 125°C
  • 40 AEC-Q100 125°C Specifications
  • 41 SAM DA1 Electrical Characteristics
  • 42 Appendix A
  • 43 Appendix B
  • 44 Packaging Information
    • 44.1 Package Drawings
      • 44.1.1 64-Pin TQFP
      • 44.1.2 64-Pin VQFN
      • 44.1.3 64-Lead QFN with Sawn Wettable Flanks
      • 44.1.4 64-Pin VQFN
      • 44.1.5 64-ball UFBGA
      • 44.1.6 48-Pin TQFP
      • 44.1.7 48-Pin VQFN
      • 44.1.8 48 lead VQFN with Sawn Wettable Flanks
      • 44.1.9 45-ball WLCSP
      • 44.1.10 32-Pin TQFP
      • 44.1.11 32-Pin VQFN
      • 44.1.12 32 lead VQFN with Sawn Wettable Flanks
      • 44.1.13 35 ball WLCSP (Device Variant B)
      • 44.1.14 35 ball WLCSP (Device Variant C)
      • 44.1.15 35 Ball WLCSP (Device Variant D)
    • 44.2 Soldering Profile
    • 44.3 Package Markings
  • 45 Schematic Checklist
  • 46 Conventions
  • 47 Acronyms and Abbreviations
  • 48 Data Sheet Revision History
  • Microchip Information

44.1 Package Drawings

Note: For current package drawings, refer to the Microchip Packaging Specification, which is available at http://www.microchip.com/packaging.

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