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Low-Power, 32-bit Cortex-M0+ MCUs with 12-bit ADC, 10-bit DAC, 256-Channel PTC, RTC, and SERCOM
Low-Power, 32-bit Cortex-M0+ MCUs with 12-bit ADC, 10-bit DAC, 256-Channel PTC, RTC, and SERCOM
Product Pages
ATSAMD20E14 ATSAMD20E15 ATSAMD20E16 ATSAMD20E17 ATSAMD20E18 ATSAMD20G14 ATSAMD20G15 ATSAMD20G16 ATSAMD20G17 ATSAMD20G18 ATSAMD20J14 ATSAMD20J15 ATSAMD20J16 ATSAMD20J17 ATSAMD20J18
  1. Home
  2. 35 Packaging Information
  3. 35.2 Package Drawings
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  • Features
  • 1 Configuration Summary
  • 2 Ordering Information (1)
  • 3 Block Diagram
  • 4 Pinout
  • 5 Signal Descriptions List
  • 6 I/O Multiplexing and Considerations
  • 7 Power Supply and Start-Up Considerations
  • 8 Product Mapping
  • 9 Memories
  • 10 Processor And Architecture
  • 11 Peripherals Configuration Summary
  • 12 DSU - Device Service Unit
  • 13 Clock System
  • 14 GCLK - Generic Clock Controller

  • 15 Power Manager (PM)
  • 16 SYSCTRL – System Controller
  • 17 WDT – Watchdog Timer
  • 18 RTC – Real-Time Counter
  • 19 EIC – External Interrupt Controller
  • 20 NVMCTRL – Nonvolatile Memory Controller
  • 21 PORT - I/O Pin Controller
  • 22 Event System (EVSYS)
  • 23 SERCOM – Serial Communication Interface
  • 24 SERCOM USART
  • 25 SERCOM SPI – SERCOM Serial Peripheral Interface
  • 26 SERCOM I2C – Inter-Integrated Circuit
  • 27 TC – Timer/Counter
  • 28 Analog-to-Digital Converter (ADC)
  • 29 AC – Analog Comparators
  • 30 DAC – Digital-to-Analog Converter
  • 31 PTC - Peripheral Touch Controller
  • 32 Electrical Characteristics at 85°C
  • 33 Electrical Characteristics at 105°C
  • 34 AEC-Q100 Electrical Characteristics at 125℃
  • 35 Packaging Information
    • 35.1 Thermal Considerations
    • 35.2 Package Drawings
      • 35.2.1 64-Pin TQFP for Industrial and AEC-Q100 Variants
      • 35.2.2 64-Pin VQFN for Industrial Variants
      • 35.2.3 64 pin VQFN for AEC-Q100 Variants
      • 35.2.4 64-ball UFBGA
      • 35.2.5 48-Pin TQFP for Industrial and AEC-Q100 Variants
      • 35.2.6 48-Pin VQFN for Industrial Variants
      • 35.2.7 48 pin VQFN for AEC-Q100 Variants
      • 35.2.8 45-ball WLCSP
      • 35.2.9 32-Pin TQFP for Industrial and AEC-Q100 Variants
      • 35.2.10 32-Pin VQFN for Industrial Variants
      • 35.2.11 32 pin VQFN for AEC-Q100 Variants
      • 35.2.12 27-ball WLCSP
    • 35.3 Soldering Profile
  • 36 Schematic Checklist
  • 37 Data Sheet Revision History
  • 38 Conventions
  • 39 Acronyms and Abbreviations
  • 40 Product Identification System
  • Microchip Information

35.2 Package Drawings

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.

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