16.1.1 32 pin QFN

Note: The exposed die attach pad is connected inside the device to GND and GNDANA.

Table 16-1. Device and Package Maximum Weight
90	mg

Table 16-2. Package Characteristics
Moisture Sensitivity Level	MSL3

Table 16-3. Package Reference
JEDEC Drawing Reference	MO-220
JESD97 Classification	E3

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