16.1.1 32 pin QFN

Note: The exposed die attach pad is connected inside the device to GND and GNDANA.
Table 16-1. Device and Package Maximum Weight
90mg
Table 16-2. Package Characteristics
Moisture Sensitivity LevelMSL3
Table 16-3. Package Reference
JEDEC Drawing ReferenceMO-220
JESD97 ClassificationE3