Jump to main content
IEEE 802.15.4 Sub-GHz System-in-Package Datasheet
Search
Home
7
I/O Multiplexing and Considerations
Introduction
Features
1
Description
2
Configuration Summary
3
Ordering Information
4
System Introduction
5
Pinout
6
Signal Description
Functional description of signals available at the package or routed in between the system dies.
7
I/O Multiplexing and Considerations
7.1
Multiplexed Signals
7.2
Internal Multiplexed Signals
7.3
Other Functions
8
Power Supply and Start-Up Considerations
9
Product Mapping
10
Memories
11
Processor and Architecture
12
Application Schematic Introduction
13
Reference Guide - SAM L21
14
Reference Guide - AT86RF212B
15
Electrical Characteristics
16
Packaging Information
17
Schematic Checklist
18
Design Considerations
19
Conventions
20
Acronyms and Abbreviations
21
Continuous Transmission Test Mode
22
Errata
23
References
24
Document Revision History
The Microchip Website
Product Change Notification Service
Customer Support
Microchip Devices Code Protection Feature
Legal Notice
Trademarks
Quality Management System
Worldwide Sales and Service
7 I/O Multiplexing and Considerations
