16.1.2 48 pin QFN

Note: The exposed die attach pad is not connected electrically inside the device.

Table 16-4. Device and Package Maximum Weight
140	mg

Table 16-5. Package Characteristics
Moisture Sensitivity Level	MSL3

Table 16-6. Package Reference
JEDEC Drawing Reference	MO-220
JESD97 Classification	E3

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.