10 Revision History

Revision B (May 2025)

Corrected clock numbers in Figure 7-1; minor editorial updates throughout the document.

Revision A (May 2019)

Updated to the Microchip template. Microchip DS20006193 replaces Atmel document 8698. Updated Part Marking Information. Added ESD rating. Removed lead finish designation. Added POR recommendations section. Updated trace code format in package markings. Updated section content throughout for clarification. Updated the SOIC, TSSOP, and UDFN package drawings to the Microchip equivalents.

Atmel Document 8698 Revision E (January 2015)

Added the UDFN Expanded Quantity Option and ordering information. Updated the 8MA2 package outline drawing.

Atmel Document 8698 Revision D (July 2014)

Updated part markings, 8MA2 and 8U2-1 package drawings, package 8A2 to 8X, template, logos, and disclaimer page. No change to functional specification.

Atmel Document 8698 Revision C (August 2011)

Updated 8A2 and 8S1 package drawings. Corrected page 13, Device Density from 156K to 256K. Corrected page 9, table headings. Corrected cross references on pages 7, 8, and 9.

Atmel Document 8698 Revision B (March 2010)

Updated Catalog Numbering Scheme. Updated Ordering Information and package types.

Atmel Document 8698 Revision A (December 2009)

Initial document release.