48.3.6 Thermal Characteristics

Table 48-6. 
Standard Operating Conditions (unless otherwise stated)
Param No.Sym.CharacteristicTyp.UnitsConditions
TH01θJAThermal Resistance Junction to Ambient60°C/W28-pin SPDIP package
80°C/W28-pin SOIC package
90°C/W28-pin SSOP package
27.5°C/W28-pin VQFN package
47.2°C/W40-pin PDIP package
29°C/W40-pin QFN package
46°C/W44-pin TQFP package
24.8°C/W48-pin VQFN package
62.8°C/W48-pin TQFP package
TH02TJMAXMaximum Junction Temperature150°C
Note:
  1. See “Absolute Maximum Ratings” for total power dissipation.