512-KB Flash, 64-KB SRAM with TrustZone, Crypto & Enhanced PTC

Operating Conditions
  • 1.62V - 3.63V, -40ºC to +125ºC, DC to 40 MHz (PIC32CM LE00/LS00)
  • 1.62V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LE00/LS00)
  • 2.0V - 3.63V, -40ºC to +85ºC, DC to 48 MHz (PIC32CM LS60)
Core
  • Arm® Cortex®-M23 CPU running at up to 48 MHz:
    • 2.64 CoreMark/MHz and 1.03 DMIPS/MHz
    • Single-cycle hardware multiplier
    • Hardware divider
    • Nested Vector Interrupt Controller (NVIC)
    • Memory Protection Unit (MPU)
    • Stack Limit Checking
    • TrustZone® for ARMv8-M (optional)
Memories
  • 512/256/128 KB Flash
  • 16/8/4 KB Data Flash Write-While-Read (WWR) section for non-volatile data storage
  • 64/32/16 KB SRAM
  • Up to 512 bytes TrustRAM with physical protection features
  • 32 KB Boot ROM
System
  • Power-on Reset (POR) and programmable Brown-out Detection (BOD)
  • Up to 16-channel Direct Memory Access Controller (DMAC)
  • Up to 12-channel event system for Inter-peripheral Core-independent Operation
  • CRC-32 generator
Low-Power and Power Management
  • Active, Idle, Standby with partial or full SRAM retention and off sleep modes:
    • Active mode (< 40 μA/MHz for PL0, < 60 μA/MHz for PL2)
    • Idle mode (< 15 μA/MHz) with 1.5 μs wake-up time
    • Standby with Full SRAM retention (1.7 μA) with 2.7 μs wake-up time
    • Off mode (< 100 nA)
  • Static and dynamic power gating architecture
  • Sleepwalking peripherals
  • Two performance levels
  • Embedded Buck/LDO regulator with on-the-fly selection
Security and Safety
  • Up to eight input pins and eight output pins for anti-tampering detections
  • Data Flash
    • Optimized for secure storage
    • Address and Data Scrambling with user-defined key (optional)
    • Tamper erase of scrambling key and of one user-defined row
    • Silent access for data read noise reduction
  • TrustRAM
    • Address and Data scrambling with user-defined key
    • Anti-tamper Active Shield on physical TrustRAM
    • Tamper Erase of scrambling key and TrustRAM data
    • Silent access for data read noise reduction
    • Data remanence prevention
  • Peripherals
    • One True Random Number Generator (TRNG)
    • AES-256/192/128, SHA-256, and GCM cryptography accelerators (optional)
    • Secure pin multiplexing capability to isolate secure communication channels with external devices from the non-secure application (optional)
  • TrustZone for flexible hardware isolation of memories and peripherals (optional)
    • Up to five regions for the Flash
    • Up to two regions for the Data Flash
    • Up to two regions for the SRAM
    • Individual security attribution for each peripheral, I/O, external interrupt line, and Event System Channel
  • SHA-based or HMAC-based secure boot (optional)
Security and Safety continued...
  • ATECC608B-TFLXTLS CryptoAuthentication™ device (optional)
    • One Permanent Primary P-256 Elliptic Curve Cryptography (ECC) Private Key
    • One Internal Sign Private Key for Key Attestation
    • Three Secondary P-256 ECC Private Keys
    • Signer Public Key from Signer Certificate
    • Public Key Validation Support
    • One Customizable Symmetric Secret Key Slot
    • I/O Protection Key Slot to Protect Communication
    • Secure Boot Enabled with Customizable Secure Boot Public Key
    • ECDH/KDF Key Slot Capable
    • X.509 Compressed Certificate Storage
    • Customizable Certificate Storage Slots
  • Device Identity Composition Engine (DICE) security standard support with Unique Device Secret (UDS) (optional)
  • Up to three debug access levels
  • Up to three chip erase commands to erase part of or the entire embedded memories
  • Unique 128-bit serial number
Timers/Output Compare/Input Capture
  • Three 16-bit Timers/Counters (TC), each configurable as:
    • One 16-bit TC with two compare/capture channels
    • One 8-bit TC with two compare/capture channels
    • One 32-bit TC with two compare/capture channels, by using two TCs
  • Up to three 24-bit Timers/Counters for Control (TCC), with configurable extensions:
    • Fault Detection
    • Dithering
    • Dead-time insertion
    • Pattern Generation
  • One 16-bit Timers/Counter for Control (TCC), with fault detection support
  • 32-bit Real-Time Counter (RTC) with clock/calendar functions
  • PWM Outputs using TC and TCC peripherals:
    • Up to eight PWM outputs on each 24-bit TCC0 and TCC3
    • Up to four PWM outputs on 24-bit TCC1
    • Up to two PWM outputs on 16-bit TCC2
    • Up to two PWM outputs on each 16-bit TC
  • Watchdog Timer (WDT) with Window mode
Communication Interfaces
  • USB Full-Speed Device and Host
    • Crystal-less operation in Device mode using DFLL48M
    • Supports 8 IN endpoints and 8 OUT endpoints in Device mode, no endpoint size limitations
    • Supports 8 physical pipes in Host mode, no pipe size limitations
    • Integrated serial resistors
  • Up to six Serial Communication Interfaces (SERCOM) that can operate as:
    • USART with full-duplex and single-wire half-duplex configuration
    • I2C up to 3.4 Mbit/s (High-Speed mode)
    • Serial Peripheral Interface (SPI)
    • ISO7816
    • RS-485
    • LIN Host/Client
    • ATECC608B-TFLXTLS CryptoAuthentication interface (optional)
  • One Inter-IC Sound Interface (I2S) with up to 8-slot TDM and PDM microphone support (optional)
Advanced Analog and Touch
  • One 12-bit 1 MSPS Analog-to-Digital Converter (ADC) with up to 24 channels
  • Up to four Analog Comparators (AC) with window compare function
  • Two 12-bit 1 MSPS Digital-to-Analog Converter (DAC) that can operate as:
    • Two independent DACs in Single-Ended mode
    • One single DAC in Differential mode
  • Three Operational Amplifiers (OPAMP)
  • One enhanced Peripheral Touch Controller (PTC):
    • Up to 32 self-capacitance channels
    • Up to 256 (16 x 16) mutual-capacitance channels
    • Low-power, high-sensitivity, environmentally robust capacitive touch buttons, sliders, wheels, and trackpads
    • Driven Shield Plus for better noise immunity and moisture tolerance
    • Parallel Acquisition (Boost Mode) through Polarity control
    • Hardware noise filtering and noise signal desynchronization for high conducted immunity
    • Supports wake-up on touch from Standby Sleep mode
Clock Management
  • Flexible clock distribution optimized for low power
  • 32.768 kHz crystal oscillator (XOSC32K)
  • 32.768 kHz ultra low-power internal RC oscillator (OSCULP32K)
  • 0.4 to 32 MHz crystal oscillator (XOSC)
  • 16/12/8/4 MHz low-power internal RC oscillator (OSC16M)
  • 48 MHz digital Frequency-Locked Loop (DFLL48M)
  • 32 MHz Ultra low-power digital Frequency-Locked Loop (DFLLULP)
  • 32-96 MHz fractional digital Phase-Locked Loop (FDPLL96M)
  • Clock Failure Detection on both crystal oscillators (CFD)
  • One frequency meter (FREQM)
Debugger Development Support
  • Two-pin Serial Wire Debug (SWD) programming and debugging interface
  • Four hardware breakpoints, two data watchpoints
Input/Output (I/O)
  • Up to 80 programmable I/O lines
  • Up to sixteen external interrupts (EIC)
  • One non-maskable interrupt (NMI)
  • Up to Four-LUTs Configurable Custom Logic (CCL) that supports:
    • Combinatorial logic functions, such as AND, NAND, OR, and NOR
    • Sequential logic functions, such as Flip-Flop and Latches
Software and Tools Support: Develop Prototypes Quickly With Our Powerful, Easy-to-Use Ecosystem
  • Get code off to a head start with MPLAB Code Configurator
  • Graphically configure peripherals, software libraries, and supported RTOS with MPLAB Harmony
  • Download MPLAB® XC Compiler
  • Take advantage of MPLAB X IDE's support for 32-bit MCUs
  • Select the best debugger for the project: MPLAB ICE, MPLAB ICD, or PICkit™
Table . Packages
TypeVQFN(1)TQFP(2)
Pin Count324864324864100
I/O Pins (up to)23344823344880
Contact/Lead Pitch0.5 mm0.5 mm0.5 mm0.8 mm0.5 mm0.5 mm0.5 mm
Dimensions Body5x5x1 mm7x7x0.90 mm9x9x1 mm7x7x1 mm7x7x1 mm10x10x1 mm14x14x1 mm
Note:
  1. The VQFN packages have wettable flanks.
  2. The 48-pin TQFP package is only available for PIC32CM LE00/LS00.