6 Appendix B

This section provides information about the device IDs and pinout descriptions.

Table 6-1. Programming Pin Locations by Package Type
DevicePackagePackage CodeVDDVDDIO2VSSMCLRICSPCLKICSPDAT
PINPINPINPINPORTPINPORTPINPORT

PIC18F24Q24
PIC18F25Q24
PIC18F26Q24

28-Pin SPDIP(SP)201819, 81RE327RB628RB7
28-Pin SOIC(SO)201819, 81RE327RB628RB7
28-Pin SSOP(SS)201819, 81RE327RB628RB7
28-Pin VQFN(STX)171516, 526RE324RB625RB7

PIC18F45Q24
PIC18F46Q24

40-Pin PDIP(P)32, 112631, 121RE339RB640RB7
40-Pin VQFN(MP)26, 7127, 616RE314RB615RB7
44-Pin TQFP(PT)28, 7129, 618RE316RB617RB7

PIC18F55Q24
PIC18F56Q24

48-Pin VQFN(6LX)30, 7131 , 620RE318RB619RB7
48-Pin TQFP(PT)30, 7131, 620RE318RB619RB7
Note:

The most current package drawings are located in the Microchip Packaging Specification, DS00000049 (http://www.microchip.com/packaging). The drawing numbers listed above do not include the current revision designator, which is added at the end of the number.