10 Revision History

Revision C (September 2026)

Removed VFBGA package that has reached end-of-life status. Made minor editorial updates throughout the document.

Revision B (February 2024)

Removed 8-pad XDFN product offering. Replaced terminology "Master" and "Slave" with "Host" and "Client," respectively.

Revision A (August 2019)

Updated to the Microchip template. Microchip DS20006244 replaces Atmel document 5228. Updated Part Marking Information. Added ESD rating. Removed the 8‑ball WLCSP detail and ordering code. Removed lead finish designation. Added POR recommendations section. Updated trace code format in package markings. Updated section content throughout for clarification. Updated the 8U3‑1 VFBGA package drawing. Updated the SOIC, TSSOP and UDFN package drawings to the Microchip equivalents.

Atmel Document 5228 Revision G (January 2015)

Add the AT25080B-MAHL-E and AT25160B-MAHL-E package options. Update the 8MA2 and 8U-12 package drawings and the ordering information.

Atmel Document 5228 Revision F (July 2014)

Add WLSCP package option. Update 8X, 8MA2, 8ME1, and 8U3-1 package drawings. Update template, Atmel logos, disclaimer page.

Atmel Document 5228 Revision E (March 2012)

Update 8A2 to 8X and 8S1, 8MA2, 8U3-1 package drawings.

Atmel Document 5228 Revision D (April 2010)

Update Ordering Code Detail and Ordering Information.

Atmel Document 5228 Revision C (August 2009)

Change Catalog Scheme and add Marking Details.

Atmel Document 5228 Revision B (July 2008)

Change ‘Endurance’ parameter on page 6.

Atmel Document 5228 Revision A (September 2007)

Initial document release.