50.3.6 Thermal Characteristics

Table 50-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	60	°C/W	28-pin SPDIP package
			80	°C/W	28-pin SOIC package
			90	°C/W	28-pin SSOP package
			27.5	°C/W	28-pin VQFN 6x6 mm package
			47.2	°C/W	40-pin PDIP package
			29	°C/W	40-pin VQFN package
			46	°C/W	44-pin TQFP package
			62.8	°C/W	48-pin TQFP package
			24.8	°C/W	48-pin VQFN package
TH02	T_JMAX	Maximum Junction Temperature	150	°C
Note: See “Absolute Maximum Ratings” for total power dissipation.