5.8 I/O Characteristics for Ports PB0 to PB7 and PC0 to PC5

All parameters refer to GND (backplane) and are valid for Tamb = -40°C to +85°C, VVS = 1.9-3.6V (3V application) and 2.4-5.5V (5V application) over all process tolerances, unless otherwise specified. Typical values are given at VVS = 5V, Tamb = 25°C and for a typical process, unless otherwise specified. Crystal oscillator frequency fXTO = 24.305 MHz. Standard Microchip EEPROM settings are used unless marked with *1.
Table 5-5. I/O Characteristics for Ports PB0 to PB7 and PC0 to PC5
No.ParametersTest ConditionsPinSymbolMin.Typ.Max.UnitType*
15.00Input low voltagePC0 to PC5

PB0 to PB7

14-19

22-29

VIL-0.30.2x VVSVA
15.05Input low leakage current I/O pinPC0 to PC5

PB0 to PB7

14-19

22-29

IIL-1µAA
15.10Input high voltagePC0 to PC5

PB0 to PB7

14-19

22-29

VIH0.8x VVSVVS+0.3VA
15.15Input high leakage current I/O pinPC0 to PC5

PB0 to PB7

14-19

22-29

IIH1µAA
15.20Output low voltageFor 3V application

IOL = 0.2 mA

14-19

22-29

VOL_3V0.1x VVSVA
For 5V application

IOL = 0.8 mA

VOL_5V0.1x VVSVA
15.30Output high voltageFor 3V application

IOH = -0.2 mA

14-19

22-29

VOH_3V0.9xVVSVA
For 5V application

IOH = -0.8 mA

VOH_5V0.9xVVSVA
15.40I/O pin pull-up resistorOFFMode – see port B and port C14-19

22-29

RPU305070kWA
15.50Output low voltage for strong LED low-sided river (PB7)Configurable on pin PB7 For 3V application

ILOAD = 1.5 mA

29

VOL_STR10.1x VVSVA
For 5V applicationILOAD = 5 mA, see I/O Ports, port configuration0.1x VVSVA
15.60Output high voltage for strong LED/LNA high- side driver (PB7, PB4)Configurable on pin PB7 and PB4

For 3V application

ILOAD = -1.5 mA

26,29VOH_STR10.9x VVSVA
For 5V application

ILOAD = -5 mA, see I/O Ports, port configuration

0.9x VVSVA
15.70Output low voltage for strong ISP low-side driver (PB3)Activated in ISP mode

IOL = 1.7 mA,

VVs>2.5V

Tamb = -40°C to +65°C

25VOL_STR20.1xVVS

0.1x

VVS

V

V

B

B

15.80Output high voltage for strong ISP high-side driver (PB3)Activated in ISP mode

IOH = -1.7 mA,

VVs >2.5V

Tamb = -40°C to +65°C

25VOH_STR20.9xVVS

0.9xVVS

V

V

B

B

15.90CLK_OUT output frequencyXTO, FRC or SRC related clock fCLK_OUT = fOSC/(2 * CLKOD)22fCLK_OUT4.5MHzB
16.00CLK_OUT duty cycleCLOAD_CLK_OUT = 10 pF

fCLK_OUT = 4.5 MHz

22DTYCLK_OUT4555%A
16.10I/O pin output delay time (rising edge)For 3V application

CLoad = 10 pF

14-19

22-29

Tdel_rise_3V13.617.522.4nsD
For 5V application

CLoad = 10 pF

Tdel_rise_5V9.712.415.7nsD
16.20I/O pin rise time (0.1×VVS to 0.9×VVS)For 3V application

CLoad = 10 pF

14-19

22-29

Trise_3V20.723.928.4nsD
For 5V application

CLoad = 10 pF

Trise_5V12.714.316.6nsD
16.30I/O pin slew rate (rising edge)For 3V application

CLoad = 10 pF

14-19

22-29

Tsr_rise_3V0.1150.1000.084V/nsD
For 5V application

CLoad = 10 pF

Tsr_rise_5V0.3150.2800.240V/nsD
16.40I/O pin output delay time (falling edge)For 3V application

CLoad = 10 pF

14-19

22-29

Tdel_fall_3V13.717.422.7nsD
For 5V application

CLoad = 10 pF

Tdel_fall_5V10.412.216.0nsD
16.50I/O pin fall time (0.9×VVS to 0.1×VVS)For 3V application

CLoad = 10 pF

14-19

22-29

Tfall_3V16.219.222.5nsD
For 5V application

CLoad = 10 pF

Tfall_5V10.412.413.7nsD
16.60I/O pin slew rate (falling edge)For 3V application

CLoad = 10 pF

14-19

22-29

Tsr_fall_3V0.1480.1250.106V/nsD
For 5V application

CLoad = 10 pF

Tsr_fall_5V0.3840.3220.292V/nsD
Note: *1 Type means: A = 100% tested at voltage and temperature limits, B = 100 % correlation tested, C = Characterized on samples and D = Design parameter