The ATWINC3400-MR210xA module package details
are outlined in the following figure. Figure 12-1. ATWINC3400-MR210CA Footprint and Module Package Drawings - Top, Bottom
and Side View
Figure 12-2. ATWINC3400-MR210CA Module Package Drawings - 3D View and Recommended Land
Pattern
Figure 12-3. ATWINC3400-MR210UA Footprint and Module Package Drawings - Top, Bottom and
Side View
Figure 12-4. ATWINC3400-MR210UA Module Package Drawings - 3D View and Recommended
Land Pattern
Note:
Dimensions are in mm.
Having a 5x5 grid of GND vias
solidly connecting the exposed GND paddle of the module to the ground plane
on the inner/other layers of the host board is recommended. This will
provide a good ground and thermal transfer for the ATWINC3400-MR210xA module.
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.
