12 Package Outline Drawings

The ATWINC3400-MR210xA package details are outlined in this section.

Note:

Dimensions are in mm.
Having a 5×5 grid of GND vias solidly connecting the exposed GND paddle of the module to the ground plane on the inner/other layers of the host board is recommended. This will provide a good ground and thermal transfer for the ATWINC3400-MR210xA module.

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