38.3.6 Thermal Characteristics

Table 38-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	60	°C/W	28-pin SPDIP package
			80	°C/W	28-pin SOIC package
			90	°C/W	28-pin SSOP package
			27.5	°C/W	28-pin QFN 6x6mm package
			27.5	°C/W	28-pin VQFN 4x4 mm package
			34.2	°C/W	28-pin VQFN 6x6mm package
TH03	T_JMAX	Maximum Junction Temperature	150	°C
Note: See "Absolute Maximum Ratings" for total power dissipation.

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