Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
The top layer (underneath the module) of the host board must be ground with as many GND vias as possible as shown in the following figure.
Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the edge of the WINCS02 Module.
For a better GND connection to the WINCS02 Module, solder the exposed GND pads of the WINCS02 Module on the host board.
For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to all the layers and thermal conduction path.
Having a series resistor on the host board for
all reserved pins and digital interface pins is recommended. These resistors must be
placed close to the WINCS02 Module.
The RTCC Oscillator (32.768 kHz) on the host board must be placed close to the WINCS02 Module and follow the shortest trace routing length with no vias (see the following figure).Figure 2-11. Example of RNWF02 Module Placement on Host Board (Top Layer)
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