68.1 240-Ball TFBGA Mechanical Characteristics

Table 68-1. 240-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 68-2. Device and 240-ball TFBGA Package Weight
250 mg
Table 68-3. Package Reference
J-STD-609 Classification e8
Table 68-4. 240-ball TFBGA Package Information
Ball Land 0.45 mm
Nominal Ball Diameter 0.35 mm
Solder Mask Opening 0.250 mm
Solder Mask Definition SMD
Solder LF35