10 Revision History

Revision B (October 2024)

Corrected Table 8-1 to show A0 pin needs VHV to read the RSWP state. Updated old Atmel 8U3 package drawing to the Microchip version. No changes to form, fit or function.

Revision A (December 2020)

Updated to Microchip template. Microchip DS20006480 replaces Atmel document 8781. Updated Part Marking Information. Updated the "Software Reset" section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Added a figure for “System Configuration Using Two‑Wire Serial EEPROMs”. Updated "Block Diagram" figure. Added POR recommendations section. Updated formatting to current template. Replaced terminology "Master" and "Slave" with "Host" and "Client", respectively. Updated the 8U3-1 VFBGA package drawing. Updated the SOIC, TSSOP and UDFN package drawings to Microchip format.

Atmel Document 8781 Revision D (January 2015)

Add the UDFN Expanded Quantity Option and update the ordering information section. Update the 8MA2 package outline drawing.

Atmel Document 8781 Revision C (July 2014)

Updated various language elements for consistency with JEDEC EE1002/1002A. Updated AC timing terminology for consistency with JEDEC EE1002/1002A. Added 100 kHz timing information for SPD applications using < 2.2V VCC supply. Miscellaneous formatting changes and text corrections. Update package drawings.

Atmel Document 8781 Revision B (June 2012)

Correct ordering code: AT34C02D-WWU11, Die Sale to AT34C02D-WWU11M, Wafer Sale. Update template.

Atmel Document 8781 Revision A (March 2012)

Initial document release.