13.1 SAM9X60D1G-I/LZB Dimensions

Figure 13-1. SAM9X60D1G-I/LZB Dimensions
Table 13-1. SAM9X60D1G-I/LZB Dimensions (in mm)
ParameterSymbolCommon DimensionsComments
MinTypMax
Body overall dimensionsXE27.80028.00028.200
YD27.80028.00028.200
Pad pitche0.650
PCB thicknessS1.1501.2001.250
SOM total thicknessA12.4002.450
Pad length1Top sideP1t0.550
Bottom sideP1b0.800
Pad width1P20.450
Pad gap1aaa0.200
Opening drill diameterfff0.3000.300 typical minus metallization
Pad countn152
Test point diameterjjj1.000
Test point countm3
Pad edge to SOM edge1XP2Ea1.750
YP2Eb1.750
SOM edge to first component edgeE2Ca1.150
E2Cb1.425
E2Cc1.225
E2Cd1.225
Note:
  1. Tolerances are defined as per standards:
    • IPC A600 – Class2
    • IPC 2615
  2. Test points placed under the SAM9X60D1G-I/LZB are for production purposes only. No connection to these points is allowed. To avoid any contact with the main board vias or copper areas, see the following table.