13.1 SAM9X60D1G-I/LZB Dimensions

Figure 13-1. SAM9X60D1G-I/LZB Dimensions
Table 13-1. SAM9X60D1G-I/LZB Dimensions (in mm)
ParameterSymbolCommon DimensionsComments
MinTypMax
Body overall dimensionsXE27.80028.00028.200
YD27.80028.00028.200
Pad pitche–0.650–
PCB thicknessS1.1501.2001.250
SOM total thicknessA1–2.4002.450
Pad length1Top sideP1t–0.550–
Bottom sideP1b–0.800–
Pad width1P2–0.450–
Pad gap1aaa–0.200–
Opening drill diameterfff–0.300–0.300 typical minus metallization
Pad countn–152–
Test point diameterjjj–1.000–
Test point countm–3–
Pad edge to SOM edge1XP2Ea–1.750–
YP2Eb–1.750–
SOM edge to first component edgeE2Ca–1.150–
E2Cb–1.425–
E2Cc–1.225–
E2Cd–1.225–
Note:
  1. Tolerances are defined as per standards:
    • IPC A600 – Class2
    • IPC 2615
  2. Test points placed under the SAM9X60D1G-I/LZB are for production purposes only. No connection to these points is allowed. To avoid any contact with the main board vias or copper areas, see the following table.