9.1 SAM9X60 System-in-Package (SiP)

The SAM9X60D1G-I/LZB System-On-Module embeds the SAM9X60 SiP (SAM9X60D1G), which integrates the ARM926EJ-S Arm Thumb processor-based SAM9X60 MPU with a 1-Gbit DDR2 SDRAM in a single package.

By combining the SAM9X60 with a DDR2 SDRAM memory in a single package, PCB routing complexity, area and number of layers are reduced. This makes board design easier and more robust by facilitating design for EMI, ESD and signal integrity.

For more information, refer to the SAM9X60 SiP data sheet (see Reference Documents).

The SAM9X60 SiP is available in a 14x14 mm 233-ball TFBGA package.

The SAM9X60D1G-I/LZB provides global system Reset (NRST) and Shutdown (SHDN) pins to the application board.

Note:
  • The NRST pin is an input/output pin generated by the power management unit (MCP16501) respecting power sequence timing. It is distributed internally to the microprocessor and to the Ethernet PHY, and it can be forced externally for system-level control.
  • The SHDN pin is an output pin managed by the application software. In an application case, the pin can switch on/off the 5V_MAIN external main supply.