10 Revision History

Revision C (September 2026)

Removed VFBGA package that has reached end-of-life status. Made minor editorial updates throughout the document.

Revision B (April 2024)

Corrected embedded bit in READ and WRITE waveforms.

Revision A (October 2019)

Updated to Microchip template. Microchip DS20006251 replaces Atmel document 8707. Updated Part Marking Information. Added ESD rating. Removed the 8‑pad XDFN detail and ordering code. Removed lead finish designation. Added POR recommendations section. Updated trace code format in package markings. Updated section content throughout for clarification. Updated the 8U3‑1 VFBGA package drawing. Updated the SOIC, TSSOP and UDFN package drawings to the Microchip equivalents.

Atmel Document 8707 Revision F (January 2015)

Added the UDFN Expanded Quantity Option. Updated the 8MA2 package outline drawing and the ordering information section.

Atmel Document 8707 Revision E (May 2014)

Updated part markings, package drawings, package 8A2 to 8X, template, logos, and disclaimer page. No change to functional specification.

Atmel Document 8707 Revision D (April 2013)

Corrected WRSR waveform figure 4-5, bit 7 is not writable. Updated Atmel logos and disclaimer page.

Atmel Document 8707 Revision C (June 2011)

Corrected AT25040B-SSHL marking detail. Replaced 8A2 package drawing with version E.

Atmel Document 8707 Revision B (October 2010)

Removed Preliminary.

Atmel Document 8707 Revision B (March 2010)

Replaced 8Y6 with 8MA2.

Atmel Document 8707 Revision A (February 2010)

Initial document release.