75.1 343-Ball TFBGA Mechanical Characteristics

Table 75-1. 343-Ball TFBGA Package Characteristics
Moisture Sensitivity Level	3

Table 75-2. Device and 343-Ball TFBGA Package Weight
410	mg

Table 75-3. Package Reference
JEDEC Drawing Reference	e3
J-STD-609 Classification	e8

Table 75-4. 343-Ball TFBGA Package Information
Ball Land	0.40 mm
Nominal Ball Diameter	0.35 mm
Solder Mask Opening	0.300 mm
Solder Mask Definition	SMD
Solder	SAC105

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