45.3.6 Thermal Characteristics

Table 45-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	69.8	°C/W	14-pin SOIC package
			100	°C/W	14-pin TSSOP package
			62.2	°C/W	20-pin PDIP package
			77.7	°C/W	20-pin SOIC package
			61.4	°C/W	20-pin SSOP package
			56.8	°C/W	20-pin VQFN package
TH02	T_JMAX	Maximum Junction Temperature	150	°C
Note: See “Absolute Maximum Ratings” for total power dissipation.

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