50.2.7 32 pin QFN

Note: The exposed die attach pad is connected inside the device to GND and GNDANA.
Table 50-20. Device and Package Maximum Weight
90mg
Table 50-21. Package Characteristics
Moisture Sensitivity LevelMSL3
Table 50-22. Package Reference
JEDEC Drawing ReferenceMO-220
JESD97 ClassificationE3