3.4 Temperature Specifications

Table 3-3. SY84782U Temperature Ratings
Parameter	Symbol	Min.	Typ.	Max.	Units	Conditions
Lead Temperature	T_LEAD	—	—	+260	°C	Soldering, 20 seconds
Junction Temperature	T_J	—	—	+125	°C	—
Storage Temperature	T_S	–65	—	+150	°C	—
Ambient Temperature	T_A	–40		+95	°C	—
Still-air Package Thermal Resistance	θ_JA	—	60	—	°C/W	Note 1
Junction-to-Board Package Thermal Resistance	Ψ_JB	—	33	—	°C/W	Note 1
Note: Package thermal resistance assumes exposed pas is solder (or equivalent) to the devices most negative potential on the PCB.

DS20007157A

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