11 Module Outline Drawings

The ATWILC1000-MR110PB module package details are outlined in the following figure. Dimensions are in mm.

This section provides the outline drawing for the recommended footprint for the ATWILC1000-MR110xB module. It is imperative that the center Ground Pad is provided, with an array of GND vias to provide a good ground and act as a thermal sink for the ATWILC1000-MR110xB module.

Figure 11-1. Recommended Solder Pad Footprint