15 Document Revision History

The document revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication.


Revision	Date	Section	Description
G	09/2025	Features, Description and Features	Added support for IEEE 802.11 WPA3 and WPA3-Enterprise Security
		Appendix A: Regulatory Approval	Updated the section
		Module Outline Drawings	Removed tolerance details
F	03/2025	Features	Added compatibility for Wi-Fi® 6/7 2.4 GHz band Removed Wi-Fi Direct Support Updated Superior MAC throughput features
		Module Outline Drawings	Updated Package Drawings
		MAC Features	Removed PCF and Traffic scheduling in IEEE 802.11e WMM QoS Removed Transmission in Advanced IEEE 802.11n Features Removed Independent Basic Service Set (IBSS) from features
		Description	Removed HCCA
		PHY Features	Editorial updates
		WLAN Subsystem	Updated content
E	06/2021	Document	Updated terminologies. For more details, see the following note.
		Ordering Information and Module Marking	Updated Figure 1-1 with packing information.
		Appendix A: Regulatory Approval	Updated Safety related standard in Europe
D	10/2020	Features	Updated this section
		Pinout and Package Information	Updated this section
		Electrical Specifications	Updated VDDIO and VBAT specification in Recommended Operating Conditions Added 4.3 DC Characteristics Updated Table 4-5.
		Nonvolatile Memory (eFuse)	Updated this section with new information and Figure 6-1
		WLAN Subsystem	Added footnotes for Short GI feature
		External Interfaces	Updated this section Updated Figure 8-1
		Reference Design	Added Notes
		Design Consideration	Updated ATWILC1000-MR110UB Placement and Routing Guidelines Added Recommended External Antennas section Updated following sections with standard text: Reflow Profile Information Module Assembly Considerations Added Conformal Coating section
		Module Outline Drawings	Added tolerance details for the mechanical dimensions
		Appendix A: Regulatory Approval	Added Gain Table for Individual Regulatory Region section Updated United States and Canada with the details of antennas used for approval Revamped Europe Updated module label information in Korea Updated expiry date information in China Added product webpage link in Other Regulatory Information
		Reference Documentation	Updated
C	05/2019	Ordering Information and Module Marking	Updated Regulatory Certification
C	05/2019	Appendix A: Regulatory Approval	Updated with ATWILC1000-MR110PB information Added European Compliance table Added Japan Korea, Taiwan and China
B	10/2017	MAC Features	Editorial updates
A	08/2017	Document	Updated from Atmel to Microchip template. Assigned a new Microchip document number. Previous version is Atmel 42503 revision C. ISBN number added. Updated module reference to ATWILC1000-MR110xB throughout the document. Removed reference to Bluetooth coexistence Added WFA certification details Updated block diagram Figure 2-1 Updated pin description in Table 3-1 Updated VDDIO absolute maximum voltage rating in Table 4-1 and added caution footnote Added operating temperature to Table 4-2 Moved Transmitter Performance, Receiver Performance and Timing Characteristics under Electrical Specifications Updated description in Nonvolatile Memory (eFuse) Revised the Transmitter Performance and Receiver Performance Updated Reference Design Added Design Consideration Updated Reference Documentation

Note: Microchip is aware that some terminologies used in the technical documents and existing software codes of this product are outdated and unsuitable. This document may use these new terminologies, which may or may not reflect on the source codes, software GUIs, and the documents referenced within this document. The following table shows the relevant terminology changes made in this document.

Table 15-1. Terminology Related Changes
Old Terminology	New Terminology	Description
Master	Host	The following sections are updated with new terminology: Pinout and Package Information SPI Timing SDIO Timing I²C Timing Interfacing with the Host Microcontroller SPI Client Interface SDIO Client Interface I²C Client Interface
Slave	Client

(Atmel) Rev C - 11/2016


Section	Changes
Document	Updated the device pinout drawing Figure 3-1 to make it easier to read Added section regarding PCBA coatings Updated Marking diagram in Figure 1-1 Revised values for Transmit Power and added notes in Table 4-5 Added Pins and Agencies to Ordering Information in Table 1-1 Added section ATWILC1000-MR110UB Placement and Routing Guidelines Types for ATWILC1000-MR110UB Added Certification Notices Added Appendix A: Regulatory Approval Updated Description to indicate both the MR110PB and MR110UB are covered Removed "With seamless roaming capabilities" from description Revised features to only support SPI and SDIO hosts Removed references to WAPI Removed UART Moved Solder Pad drawing to be with POD drawings as in Figure Minor edits

(Atmel) Rev B - 5/2016


Section	Changes
Document	Revised POD drawings in Module Outline Drawings Revised Footprint drawing in Module Outline Drawings Removed Module schematics and BOM’s Added Reflow profile Reflow Profile Information Updated SDIO timing content in SDIO Client Timing Added footnotes to recommended operating ratings in Recommended Operating Conditions Updated SPI timing content in SPI Client Timing

(Atmel) Rev A - 8/2015


Section	Changes
Document	Updated due to changes from ATWILC100A(42380D) to ATWILC1000B: Updated power numbers and description, added high-power and low-power modes Updated radio performance numbers Fixed typos in SPI interface timing Added hardware accelerators in feature list (security and checksum) Increased instruction RAM size from 128KB to 160KB Improved and corrected description of Coexistence interface Miscellaneous minor updates and corrections