Jump to main content

IEEE 802.15.4 Sub-GHz System-in-Package Datasheet

Home
17 Schematic Checklist
17.2 Power Supply
17.2.2 Special Considerations for QFN Packages

Introduction
Features
1 Description
2 Configuration Summary
3 Ordering Information
4 System Introduction
5 Pinout
6 Signal Description
Functional description of signals available at the package or routed in between the system dies.
7 I/O Multiplexing and Considerations
8 Power Supply and Start-Up Considerations
9 Product Mapping
10 Memories
11 Processor and Architecture
12 Application Schematic Introduction
13 Reference Guide - SAM L21
14 Reference Guide - AT86RF212B
15 Electrical Characteristics
16 Packaging Information
17 Schematic Checklist
18 Design Considerations
19 Conventions
20 Acronyms and Abbreviations
21 Continuous Transmission Test Mode
22 Errata
23 References
24 Document Revision History
The Microchip Website
Product Change Notification Service
Customer Support
Microchip Devices Code Protection Feature
Legal Notice
Trademarks
Quality Management System
Worldwide Sales and Service

17.2.2 Special Considerations for QFN Packages

The QFN package has an exposed paddle that must be connected to GND.

About

Company

Careers

Contact Us

Media Center

Investor Relations

Corporate Responsibility

Support

Microchip Forums

AVR Freaks

Design Help

Technical Support

Export Control Data

PCNs

Quick Links

microchipDIRECT.com

Microchip University

myMicrochip

Blogs

Reference Designs

Parametric Search

Microchip Technology Inc.

2355 West Chandler Blvd.

Chandler, Arizona, USA

Microchip Twitter

Microchip Weibo

© Copyright 1998-2024 Microchip Technology Inc. All rights reserved. Shanghai ICP Recordal No.09049794

Terms Of Use

Privacy Notice

Legal

Your Privacy Choices California Consumer Privacy Act (CCPA) Opt-Out Icon

California Consumer Privacy Act (CCPA) Opt-Out Icon