1 Features

  • CPU Running up to 800 MHz
    • ARM926EJ-S Arm Thumb® processor
    • 32-Kbyte data cache, 32-Kbyte instruction cache, Memory Management Unit (MMU)
  • Memories
    • One 176-Kbyte internal ROM
      • 80-Kbyte internal ROM embedding a secure bootloader program supporting boot on NAND Flash, SD Card, SPI or QSPI Flash; bootloader features selectable by OTP bits
      • 96-Kbyte ROM for NAND Flash BCH ECC table
    • One 64-Kbyte internal SRAM (SRAM0), single cycle access at system speed
    • Internal DDR2 or DDR3L SDRAM running at up to 266 MHz
    • External Bus Interface (EBI) supporting:
      • 8-bit NAND Flash with up to 24-bit programmable multi-bit error correcting code
    • One 10-Kbyte OTP memory for secure key storage with Emulation mode (OTP bits are emulated by a 4-Kbyte SRAM (SRAM1))
  • System Running up to 266 MHz
    • Power-on reset cells, reset controller, shutdown controller, periodic interval timer, watchdog timer running on internal slow RC oscillator (32 kHz typical) and real-time clock running on slow crystal oscillator (32.768 kHz)
    • Two internal trimmed RC oscillators with typical values: 32 kHz (slow) and 12 MHz (fast)
    • Two crystal oscillators: 32.768 kHz (slow) and 20 to 50 MHz (fast)
    • One PLL for the system and one PLL optimized for USB high-speed operation (480 MHz)
      • One PLL for audio operations, with dedicated output clock
      • One PLL in LVDS I/F (LVDS usage only)
      • One PLL in MIPI DPHY (MIPI DSI usage only)
    • One dual-port 16-channel DMA controller
    • Advanced interrupt controller and debug unit
    • JTAG port with disable bit in OTP memory
    • Two programmable clock output signals
  • Low-Power Modes
    • Backup mode with RTC, eight 32-bit general-purpose backup registers, and a shutdown controller to control the external power supply
    • Clock generator and power management controller
    • Software-programmable ultra-low power modes: very slow clock operating mode (ULP0) and no-clock operating mode (ULP1) with fast wake-up capabilities
    • Software programmable power optimization capabilities
  • Peripherals
    • LCD controller with overlay, alpha blending, rotation, scaling and color conversion; up to 720p resolution
      • RGB, LVDS, MIPI-DSI interfaces
    • 2D graphics controller supporting fill BLT, copy BLT, transparent BLT, blend/alpha BLT, ROP4 BLT (raster operations) and command ring buffer
    • Image sensor controller with ITU-R BT; 601/656/1120 video interface support up to 5 Mpixels; support of raw Bayer 12, YCbCr, monochrome and JPEG compressed sensors up to 12 bits
      • MIPI CSI2 I/F support
      • 12-bit parallel I/F support
    • One high-speed USB device, three high-speed USB hosts with dedicated on-chip transceivers
    • One 10/100/1000 Mbps Ethernet Mac controller with IEEE-1588 and TSN support, RGMII and RMII support
    • Two 4-bit secure digital multimedia card controllers
    • Two CAN FD controllers with timestamping
    • One Quad/Octal SPI controller
    • Two 3-channel 32-bit timers/counters
    • Two high-resolution (64-bit) periodic interval timers
    • One synchronous serial controller
    • One inter-IC sound multi-channel controller with TDM support
    • One audio class D controller with single-ended or bridge-tied load connection to power stage
    • One 4-channel 16-bit PWM controller
    • Thirteen FLEXCOMs (USART, SPI and TWI/I2C)
    • One 8-channel, 12-bit, analog-to-digital converter with 4/5 wires resistive touchscreen support
  • Hardware Cryptography
    • SHA (SHA1, SHA224, SHA256, SHA384, SHA512) and HMAC compliant with FIPS PUB 180
    • AES: 256-, 192-, 128-bit key algorithms compliant with FIPS PUB 197
    • AES/SHA tight coupling for IPsec hardware acceleration
    • TDES: 2-key or 3-key algorithms compliant with FIPS PUB 46
    • True random number generator compliant with NIST Special Publication 800-22 Test Suite and FIPS PUBs 140-2 and 140-3
    • Key bus providing private key transfers between AES, TDES, TRNG, OTPC
    • Physical Unclonable Function (PUF) including NIST SP 800-90B (DRNG) and embedding four Kbytes of SRAM (PUFSRAM)
  • I/O Ports
    • Four 32-bit parallel input/output controllers
    • Up to 106 programmable I/O lines multiplexed with up to four peripheral I/Os
    • Input change interrupt capability on each I/O line, optional Schmitt Trigger input
    • Individually programmable open-drain, pull-up and pull-down resistors, synchronous output
    • General-purpose analog and digital inputs tolerant to positive and negative current injection
  • Package
    • 16x16 mm2, 0.8-mm pitch, 243-ball BGA optimized for standard class PCB layout (down to four layers)
  • Design for Low ElectroMagnetic Interference (EMI)
    • Slewrate-controlled I/Os
    • DDR PHY with impedance-calibrated drivers
    • Spread spectrum PLLs
    • BGA power/ground ball assignment to provide optimum decoupling capacitors placement
  • Operating Conditions
    • Ambient temperature (TA) range:
      • -40°C to +85°C for SAM9X75D5M, SAM9X75D1G, SAM9X75D2G
      • -40°C to +105°C for SAM9X75D5M
    • Junction temperature (TJ) range: -40°C to +125°C