10 Revision History

Revision C (March 2025)

Removed TSSOP Grade 3 offering. Updated DC Characteristics table to remove "Typical" column. Updated package drawings to current version. Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively.

Revision B (May 2020)

Corrected operating ranges for Table 4-3. Updated UDFN package drawing.

Revision A (November 2019)

Updated to Microchip template. Microchip DS20006269 replaces Atmel document 8810. Updated Part Marking Information. Added ESD rating. Removed lead finish designation. Removed the Automotive Grade 2 option. Updated POR recommendations section. Updated trace code format in package markings. Updated formatting throughout for clarification. Updated the SOIC, TSSOP and UDFN package drawings to the Microchip equivalents.

Atmel Document 8810 Revision E (September 2016)

Added the Automotive Grade 2 and 3 options and UDFN options.

Atmel Document 8810 Revision D (June 2015)

Updated ordering codes tables and Section 7.1, part marking information, 8S1 and 8X package drawings and footers.

Atmel Document 8810 Revision C (December 2012)

Updated ordering code tables and the 8X package drawing.

Atmel Document 8810 Revision B (August 2012)

Removed preliminary status. Updated Atmel logos and disclaimer/copy page.

Atmel Document 8810 Revision A (April 2012)

Initial document release.