2 Typical Operating Characteristics

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: All tests have been performed without the RC Snubber. Please refer to the Evaluation Board Schematic.
Figure 2-1. VIN Operating Supply Current vs. Input Voltage
Figure 2-2. VIN Shutdown Current vs. Input Voltage
Figure 2-3. VDD Operating Supply Current vs. Input Voltage
Figure 2-4. Feedback Voltage vs. Input Voltage
Figure 2-5. Total Regulation vs. Input Voltage
Figure 2-6. Current Limit vs. Input Voltage
Figure 2-7. Switching Frequency vs. Input Voltage
Figure 2-8. VDD Operating Supply Current vs. Temperature
Figure 2-9. VDD Shutdown Current vs. Temperature
Figure 2-10. VDD UVLO Threshold vs. Temperature
Figure 2-11. VIN Operating Supply Current vs. Temperature
Figure 2-12. VIN Shutdown Current vs. Temperature
Figure 2-13. Current Limit vs. Temperature
Figure 2-14. Feedback Voltage vs. Temperature
Figure 2-15. Load Regulation vs. Temperature
Figure 2-16. Line Regulation vs. Temperature
Figure 2-17. Switching Frequency vs. Temperature
Figure 2-18. EN Bias Current vs. Temperature
Figure 2-19. Efficiency vs. Output Current
Figure 2-20. Feedback Voltage vs. Output Current
Figure 2-21. Output Voltage vs. Output Current
Figure 2-22. Line Regulation vs. Output Current
Figure 2-23. Switching Frequency vs. Output Current
Figure 2-24. Die Temperature (VIN = 5V) vs. Output Current
Note1
Figure 2-25. Die Temperature (VIN = 12V) vs. Output Current
Note1
Figure 2-26. Die Temperature (VIN = 24V) vs. Output Current
Note1
Figure 2-27. Efficiency (VIN = 5V) vs. Output Current
Figure 2-28. Efficiency (VIN = 12V) vs. Output Current
Figure 2-29. Efficiency (VIN = 24V) vs. Output Current
Figure 2-30. IC Power Dissipation (VIN = 5V) vs. Output Current
Figure 2-31. IC Power Dissipation (VIN = 12V) vs. Output Current
Figure 2-32. IC Power Dissipation (VIN = 24V) vs. Output Current
Figure 2-33. Thermal Derating vs. Ambient Temperature
Note1
Figure 2-34. Thermal Derating vs. Ambient Temperature
Note1
Figure 2-35. Thermal Derating vs. Ambient Temperature
Note1
Figure 2-36. Thermal Derating vs. Ambient Temperature
Note1
Figure 2-37. Thermal Derating vs. Ambient Temperature
Note1
Figure 2-38. VIN Soft Turn-On
Figure 2-39. VIN Soft Turn-Off
Figure 2-40. VEN Enable Turn-On Delay and Rise Time
Figure 2-41. VEN Enable Turn-Off Delay and Fall Time
Figure 2-42. VIN Start-Up with Pre-Biased Output
Figure 2-43. VEN Enable Turn-On/Turn-Off
Figure 2-44. VEN Enable Thresholds
Figure 2-45. VDD UVLO Thresholds
Figure 2-46. Power-Up into Short Circuit
Figure 2-47. Enabled into Short Circuit
Figure 2-48. Short Circuit
Figure 2-49. Output Recovery Short Circuit
Figure 2-50. Peak Current Limit Threshold
Figure 2-51. Output Recovery from Thermal Shutdown
Figure 2-52. Switching Waveforms, IOUT = 5A
Figure 2-53. Switching Waveforms, IOUT = 0A
Figure 2-54. Transient Response

Notes:

  1. The temperature measurement was taken at the hottest point on the MIC26400 case mounted on a 5 square inch 4-layer, 0.062”, FR-4 PCB with 2oz. finish copper weight per layer, see the Thermal Measurements section. Actual results will depend upon the size of the PCB, ambient temperature, and proximity to other heat emitting components.