1.4 Environmental Compliance

Table 1-6. Environmental Compliance
ParameterCondition
Mechanical ShockMIL-STD-883 Method 2002
Mechanical VibrationMIL-STD-883 Method 2007
Temperature CycleMIL-STD-883 Method 1010
SolderabilityMIL-STD-883 Method 2003
Fine and Gross LeakMIL-STD-883 Method 1014
Resistance to SolventsMIL-STD-202 Method 215
Moisture Sensitivity LevelMSL1
Contact PadsGold over Nickel (gold thickness is 0.3um–1.0um)
θJC (bottom of case)31°C/W
Weight167mg